ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,359, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Hee Sub ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,171, issued on Nov. 3, was assigned to TDK Corp. (Tokyo). "Wiring body and display device" was invented by Yuusuke Ikemura (Tokyo), Yasumasa... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,172, issued on Nov. 3, was assigned to HARTING ELECTRONICS GMBH (Espelkamp, Germany). "Printed circuit board arrangement" was invented by Ma... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,173, issued on Nov. 3, was assigned to Snap Inc. (Santa Monica, Calif.). "Air gapped dynamic-flex circuits with stripline impedance controls... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,174, issued on Nov. 3, was assigned to MetaPWR Electronics Co. Ltd. (Shanghai). "Integrated assembly and integrated power converter module" ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,175, issued on Nov. 3, was assigned to NVIDIA Corp. (Santa Clara, Calif.). "Secure electronic component assembly" was invented by Elad Mento... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,176, issued on Nov. 3, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan). "High-frequency module including an electronic componen... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,177, issued on Nov. 3, was assigned to AT&S Austria Technologie & Systemtechnik AG (Leoben, Austria). "Component carrier" was invented by Ma... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,178, issued on Nov. 3, was assigned to HITACHI ASTEMO LTD. (Hitachinaka, Japan). "Electronic device" was invented by Fumiya Iijima (Hitachin... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,179, issued on Nov. 3, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Method for manufacturing wiring substrate" was invented by Michimasa... Read More